Semiconductor Processors

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Task

• Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
• Calculate etching time based on thickness of material to be removed from wafers or crystals.
• Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
• Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
• Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
• Load and unload equipment chambers and transport finished product to storage or to area for further processing.
• Load semiconductor material into furnace.
• Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
• Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
• Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
• Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
• Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
• Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
• Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
• Scribe or separate wafers into dice.
• Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
• Stamp, etch, or scribe identifying information on finished component according to specifications.
• Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
• Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
• Connect reactor to computer, using hand tools and power tools.
• Count, sort, and weigh processed items.
• Inspect equipment for leaks, diagnose malfunctions, and request repairs.
• Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
• Maintain processing, production, and inspection information and reports.

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